The bonding pad with a special structure has a low thermal resistance of 0.8℃/W, which effectively addresses the thermal stress between the chip and substrate resulted from inconsistent coefficient of thermal expansion and substantially reduces risks of electric leakage and dead light if the chip is pulled and cracked during operation. Non-bracket package, the light emitted from a single side is close to the Lambert pattern, convenient for secondary optical design. It is particularly useful for the flashlights and backlights.